Quelle: Suntak Gruppe
| Technische Daten | 2010 | 2011 |
|---|---|---|
| Layers: | 40 | 50 |
| Max. board size: | 40" x 24" | 45" x 24" |
| Max. board thickness: | 354mil | 394mil |
| Min. board thickness: | 15.7mil | 15.7mil |
| Min. core thickness: | 2mil | 2mil |
| Max. copper thickness: | 8OZ | Inner Layer: 10OZ |
| 8OZ | Outer Layer: 10OZ | |
| Min. line width/space: | 2.5mil/2.5mil | 2.0mil/2.0mil |
| Min. CNC drilling size: | 4mil | 4mil |
| Min. laser drilling size: | 4mil | 3mil |
| Aspect ratio: | 18:01 | 20:01 |
| Impedance tolerance control: | ±5% | ±5% |
| HDI ability: | 4+N+4 | 5+N+5 |
| Heat sink: | Mass production | Mass production |
| Rigid-flex: | Mass production | Mass production |
| Embedded capacitance: | Mass production | Mass production |
| Embedded resistance: | Prototype | Mass production |
| IC substrate: | Prototype | Prototype |
| Volume Capability | 2010 | 2011 |
|---|---|---|
| Heavy copper: | 3, 4, 5, 6OZ (all layers) | |
| HDI: | laser/mechanical drill | |
| High layer count: | 4-36L | |
| Backplance: | yes | |
| Hybrid material: | Rogers + FR4 | |
| Special technology PCBs: | Silver filling | |
| Heat sink (copper and aluminum base) | ||
| Resin (conductive/non-condactive) filling | ||
| HF PCB | ||
| RF (PTFE, Rogers, Nelco, Getek, Ceramic) PCB | ||
| Leading edge technology: | 50 layers PCB | |
| Embedded resistance PCB | ||
| Embedded capacitance & resistance PCB | ||
| IC substrate PCB | ||
| HDI Capability | Track width/space: 3mil/3mil | |
| Aspect ratio: 1:1 | ||
| HDI steps: 3+N+3 (incl. stack via hole and cross via hole) | ||
| Mechanical drill | ||
| Mechanical back drilling | ||
